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| Femtocell Original Device Manufacturers |
| Written by David Chambers | ||||||||
| Sunday, 01 May 2011 17:16 | ||||||||
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Many ODMs are based on the Far East, such as Taiwan and China, where they dominate many types of consumer electronics. Their products may be commissioned with branding and logos from specific customers, such as for larger network operators or well known consumer brands. It is said that many ODMs have yet to gain practical field experience of femtocell RF (radio frequency) electronics (and especially the "secret sauce" of network optimisation algorithms), but most are familiar with Wi-Fi and/or cellular handsets. There are several commercial models operating for ODMs in femtocells today:
ODMs known to be active in femtocell design and development (not a complete list) are listed below. These can be identified from attendees at the "plugfests" organised by ETSI to test and validate interoperability using the Iu-h standard, with participants announced here, press articles, press releases from the various component manufacturers, and from the websites of these companies themselves.
This list is by no means exhaustive. Many companies have bought software stacks from the likes of Continuous Computing (who claim around 30 "design wins" for 3G femtocells to date), and these manufacturers by their nature do not all strongly market themselves (to end consumers) so are difficult to track.
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Keith Day
said:
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You missed Tecom! Tecom FC1020 residential Tecom FC1060 enterprise Tecom FC1080 outdoor (under development) http://www.tecom.com.tw/en/index.php/product-solutions/carrier/femtocell/ |
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ThinkFemtocell
said:
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... @Keith: Thanks for pointing out. I've corrected this omission and added links to their website. I'm happy to add any further amendments or corrections that viewers care to tell me about (either via a comment here or email through the contact page) |
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ODMs (Original Device Manufacturers) are a class of business common in most high volume consumer electronics equipment. They specialise in taking equipment designs from established/proven vendors, and re-engineering them for mass production at low cost. This might involve changing some of the components, redesigning the internal electronics boards/layout and packaging format. With large factory capacity, strong buying power from their component suppliers, these companies can ramp up production capacity very quickly and meet delivery orders in very short timescales.

